AMP, Inc.’s Ball Grid Array (BGA) SSDs are designed to apply itself to great use across a variety of industrial and embedded applications. Whether it be automotive, industrial, and consumer applications, this is small form factor that packs a serious punch with exacting standards.
Made to withstand intense vibration and shaking, the AMP, Inc’s BGA SSD solution ensures reliability in demanding environments. Along with incorporate LDPC error correction, wear leveling, power loss protection, and security features, delivering durability, reliability, and robust data integrity across extreme temperatures from -40°C to 105°C, this is the SSD built for extreme conditions.
BGA SSD Benefits Breakdown:
1. Smaller Form Factor
BGA SSDs are engineered with a compact design that integrates the NAND flash memory and controller directly onto your device’s motherboard, eliminating the need for additional connectors or casing. This results in a smaller, more space-efficient solution, which can be particularly important in devices with limited space.
2. Higher Durability and Reliability
Since BGA SSDs don’t use any moving parts or traditional connectors (like those in other SSD form factors), they are more resistant to physical shocks, vibration, and wear and tear. Which makes these SSDs ideal for use in rugged or portable devices that need to withstand rough conditions.
3. Lower Power Consumption
BGA SSDs generally consume less power compared to more traditional SSD form factors. This can be a significant advantage in mobile devices where power efficiency is critical for extending battery life.
4. Enhanced Heat Dissipation
The BGA package design allows for better heat dissipation, as the heat can be spread more evenly across the board, reducing the chances of overheating. This is important for maintaining optimal performance, especially in high-performance applications or when needed in extreme conditions.
5. Compact and Lightweight
Due to the absence of connectors, casing, and the use of smaller form factors, BGA SSDs are extremely lightweight and compact, which is a significant benefit for devices where every gram and inch counts.
Want to know more about AMP, Inc.’s BGA (M.2 1620) PCIe Gen4x4 3D TLC 291-ball SSD?
