UFS 2.2 Embedded Storage
AMP UFS 2.2 provides compact managed NAND storage for commercial
and embedded systems. Its compact BGA-153 package supports
space-constrained designs, while WriteBooster helps improve write
responsiveness and HPB 2.0 supports more efficient host-side data
access. The configurations shown below use 3D TLC NAND and provide
commercial-temperature operation for embedded applications.
Contact AMP to confirm current availability, approved specifications
and compatibility with your host platform.
| Specification | Commercial |
|---|---|
| Features | |
| Interface | UFS 2.2 |
| Package | BGA-153, 11.5×13×0.8/1.0 mm |
| Flash Type | 3D TLC |
| Available Configurations | |
| Capacity | 128GB / 256GB / 512GB |
| Temperature Rating | −25°C to 85°C |
| Performance (Up To)* | |
| Sequential Read / Write | 1,055 / 1,055 MB/s |
| 4KB Random Read / Write | 250K / 255K IOPS |
| WriteBooster / HPB 2.0 | Supported |
REQUEST UFS AVAILABILITY |
|
*Performance varies by capacity, NAND and configuration. Confirm
specifications using approved product documentation.
UFS 3.1 Embedded Storage
AMP UFS 3.1 provides higher managed NAND performance for commercial,
industrial and automotive embedded applications. Its BGA-153 package
supports compact board designs, while WriteBooster and HPB 2.0 help
improve write responsiveness and host read efficiency. Commercial
configurations use 3D TLC NAND, while the extended-temperature
Industrial and Automotive configurations use 218-layer TLC NAND.
Available package dimensions, operating temperatures and sequential
read/write performance vary by capacity and configuration. Contact
AMP to confirm the appropriate UFS 3.1 option for your application.
| Specification | Commercial | Industrial | Automotive | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Features | |||||||||||||||
| Interface | UFS 3.1 | UFS 3.1 | UFS 3.1 | ||||||||||||
| Package | BGA-153, 11×13×0.8/1.0 mm | BGA-153, 11.5×13 ×1.2 mm | BGA-153, 11.5×13×1.2 mm | ||||||||||||
| Flash Type | 3D TLC | TLC | TLC | ||||||||||||
| Available Configurations | |||||||||||||||
| Capacity | 128GB / 256GB / 512GB | 128GB / 256GB / 512GB | 128GB / 256GB / 512GB | ||||||||||||
| Temperature Rating | −25°C to 85°C | −40°C to 95°C | −40°C to 105°C | ||||||||||||
| Performance (Up To)* | |||||||||||||||
| Sequential Read / Write | 2,025 / 1,775 MB/s | See capacity table below | See capacity table below | ||||||||||||
| 4KB Random Read / Write | 290K / 360K IOPS | Confirm by configuration | Confirm by configuration | ||||||||||||
| WriteBooster / HPB 2.0 | Supported | Supported | Supported | ||||||||||||
|
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REQUEST UFS AVAILABILITY |
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*Performance varies by capacity, NAND and configuration. Confirm
specifications using approved product documentation.
UFS 4.1 High-Performance Embedded Storage
AMP UFS 4.1 provides high-bandwidth managed NAND storage for advanced
commercial, industrial and automotive embedded applications. Its
BGA-153 package supports compact designs, while WriteBooster and HPB
2.0 help improve storage responsiveness and host data access. The
extended-temperature configurations also support High-Speed Link Boot
Sequence for faster link initialization.
Commercial configurations use 3D TLC NAND, while the Industrial and
Automotive configurations use 218-layer TLC NAND. Package dimensions,
operating temperatures and performance vary by capacity. Contact AMP
to confirm the appropriate UFS 4.1 option for your application.
| Specification | Commercial | Industrial | Automotive | |||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Features | ||||||||||||||||||
| Interface | UFS 4.1 | UFS 4.1 | UFS 4.1 | |||||||||||||||
| Package | BGA-153, 9×13×0.8/0.9 mm | BGA-153, 11.5×13×1.2/1.3 mm | BGA-153, 11.5×13× 1.2/1.3 mm | |||||||||||||||
| Flash Type | 3D TLC | TLC | TLC | |||||||||||||||
| Available Configurations | ||||||||||||||||||
| Capacity | 256GB / 512GB / 1TB | 128GB / 256GB / 512GB / 1TB | 128GB / 256GB / 512GB / 1TB | |||||||||||||||
| Temperature Rating | −25°C to 85°C | −40°C to 95°C | −40°C to 105°C | |||||||||||||||
| Performance (Up To)* | ||||||||||||||||||
| Sequential Read / Write | 4,300 / 4,050 MB/s | See capacity table below | See capacity table below | |||||||||||||||
| 4KB Random Read / Write | 590K / 850K IOPS | Confirm by configuration | Confirm by configuration | |||||||||||||||
| WriteBooster / HPB 2.0 | Supported | Supported | Supported | |||||||||||||||
| High-Speed Link Boot Sequence | Confirm by configuration | Supported | Supported | |||||||||||||||
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REQUEST UFS AVAILABILITY |
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*Performance varies by capacity, NAND and configuration. Confirm
specifications using approved product documentation.
