Share the required DDR1 module format, pin count, capacity, speed, ECC or buffering requirement, operating-temperature range, host platform, estimated volume and required program life.
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AMP supports hard-to-find DDR1 memory for established and long-life platforms that cannot be economically redesigned around a newer memory generation. Module availability is reviewed against the original part number, form factor, capacity, data rate, rank, organization, ECC, buffering, voltage and environmental requirements.
184-pin registered or unbuffered configurations, with ECC or non-ECC options available according to the required platform and part number.
200-pin compact modules for compatible embedded computers, industrial systems and other space-constrained legacy platforms.
172-pin compact modules for qualifying systems designed specifically around the DDR1 Micro-DIMM form factor.
Full-size 184-pin DDR1 modules for compatible desktop, industrial, embedded, networking and server-class platforms.
| Configuration | ECC | Data Width |
|---|---|---|
| Registered DIMM | ECC | 72-bit |
| Unbuffered DIMM | ECC | 72-bit |
| Unbuffered DIMM | Non-ECC | 64-bit |
Capacity, data rate, rank, organization, component layout, ECC and buffering must be reviewed against the original part number and host platform.
Compact 200-pin DDR1 modules for compatible embedded computers, industrial systems and other space-constrained platforms.
| Configuration | ECC | Data Width |
|---|---|---|
| 200-pin unbuffered SO-DIMM | Non-ECC | 64-bit |
| 200-pin SO-DIMM | ECC availability by inquiry | Confirm by part number |
Confirm capacity, data rate, rank, organization, ECC requirement and mechanical compatibility for the host platform.
Compact 172-pin DDR1 modules for qualifying embedded and mobile platforms designed specifically for the Micro-DIMM form factor.
| Module | Pin Count | Availability |
|---|---|---|
| DDR1 Micro-DIMM | 172-pin | Capacity and data rate by inquiry |
Confirm the original part number, exact dimensions, keying, capacity, data rate and organization before qualification.
Configuration note: DDR1 availability varies by module format, capacity, data rate, rank, organization, ECC, buffering, temperature grade and original component configuration. Optional conformal coating, heat sink and underfill are available for selected configurations. Confirm the exact part with AMP before qualification.
DDR1 modules support established computing platforms where redesign, recertification or migration is not immediately practical.
DDR1 memory options for long-life avionics, ground systems, mission computers and qualified embedded platforms.
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DDR1 modules for railway, fleet, marine and other systems with long qualification and deployment cycles.
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Registered and unbuffered DDR1 options for compatible servers, network appliances, edge systems and communications infrastructure.
View server and networking solutionsAMP supports 184-pin DDR1 DIMM, 200-pin SO-DIMM and 172-pin Micro-DIMM configurations. Exact availability varies by module type and part number.
Yes, depending on the module format and configuration. ECC modules are 72-bit wide, while non-ECC modules are 64-bit wide. Confirm buffering, organization and host compatibility for the required part.
Capacity and data-rate availability depends on module format, organization, rank and original component configuration. AMP can review DDR-200, DDR-266, DDR-333 and DDR-400 requirements using the original part number and platform details.
Yes. Commercial-temperature options operate from 0°C to 70°C, while industrial-temperature options operate from −40°C to 85°C. Availability varies by configuration and should be confirmed by part number.
Provide the original part number, host or system model, module format and pin count, capacity, speed, voltage, ECC and buffering requirements, rank and organization, operating temperature, annual volume and expected program life.
Share the module format, pin count, capacity, speed, ECC and buffering requirements, operating grade and host platform so AMP can review compatible options.
