Description
A BGA SSD is a complete NVMe solid-state drive in a single chip package that solders directly onto the circuit board, with no connector, socket or mounting screws. The AMP commercial BGA SSD combines a compact M.2 1620 (16 × 20mm), 291-ball BGA package, a PCIe Gen4 x4 NVMe interface and 3D TLC NAND, with capacities from 128GB to 1TB for standard-temperature embedded systems from 0°C to 70°C.
It saves board space and removes the connector and mounting hardware of a plug-in M.2 SSD, which suits thin clients, compact PCs, kiosks, networking equipment and other space-constrained designs. Compare all grades on our BGA SSD page.
Key Highlights
- Compact soldered package for space-constrained boards
- Firmware power-loss protection
- Advanced LDPC error correction with wear leveling
- Temperature monitoring and thermal throttling
- DRAM-less design with Host Memory Buffer (HMB) support
Additional Specifications
| Package size | 16 × 20mm, 291-ball |
|---|---|
| TBW | Up to 2,730TB (1TB) |
| Reliability | MTBF 2.0 million hours |
Performance varies with host hardware, software and system configuration. Need industrial temperature, a different capacity or a locked bill of materials? Contact AMP.
