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Industrial UFS 4.1 3D TLC −40°C to 85°C 128GB to 1TB

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Features
SKU / Item Number:Select an option
Form Factor153-ball BGA, 11.5 × 13mm
GradeIndustrial
InterfaceUFS 4.1, HS-Gear 5, 2 lanes
ProtocolJEDEC UFS 4.1
NAND Type3D TLC
Operating Temp −40°C to 85°C (up to 95°C case)
Endurance (TBW or DWPD) 3,000 P/E cycles (minimum)
Speed (Sequential Read, MB/s)Up to 4,300
Speed (Sequential Write, MB/s)Up to 4,150

Description

UFS (Universal Flash Storage) is a soldered, single-package flash storage device that uses a high-speed serial interface, so it reads and writes far faster than eMMC while taking a similar small board space. The AMP industrial UFS 4.1 is built on the latest JEDEC UFS 4.1 standard, with 3D TLC NAND in a 153-ball BGA package, capacities from 128GB to 1TB, sequential speeds up to 4,300 MB/s read and 4,150 MB/s write, and operation from −40°C to 85°C.

WriteBooster, Host Performance Booster 2.0 and High-Speed Link Boot Sequence bring SSD-class speed and fast startup to edge AI, machine vision, robotics, industrial PCs and other compact embedded systems. Compare all options on our UFS page.

Key Highlights

  • JEDEC UFS 4.1, HS-Gear 5 with 2 lanes
  • Up to 4,300 MB/s sequential read and 4,150 MB/s write
  • WriteBooster cache up to 220GB for faster sustained writes
  • Host Performance Booster (HPB) 2.0 for faster random reads
  • High-Speed Link Boot Sequence (HS-LSS) for faster boot
  • Industrial temperature operation from −40°C to 85°C (up to 95°C case)

Availability

Industrial UFS 4.1 is now sampling, with production starting in late 2026. Contact AMP for availability.

Additional information

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